Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/008721
Kind Code:
A1
Abstract:
A semiconductor device (1) according to an embodiment of the present invention comprises a semiconductor substrate (10), insulation films (12, 14, 60a, 64, 68) provided on the semiconductor substrate, a temperature detection element (20) provided on the insulation films, and capacitive elements (22, 24, 26, 28, 55) provided on the anode side or the cathode side of the temperature detection element, the sum of capacitive values (Ca, Cacap, Ck, Ckcap) of the capacitive elements being greater than the capacitive value (Cdi) of the temperature detection element.
Inventors:
HARADA SHUNSUKE (JP)
NOMURA TAKASHI (JP)
NOMURA TAKASHI (JP)
Application Number:
PCT/JP2019/018394
Publication Date:
January 09, 2020
Filing Date:
May 08, 2019
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L21/822; H01L27/04; H01L27/06; H01L29/861; H01L29/868
Foreign References:
| JP2008211061A | 2008-09-11 | |||
| JP2002280556A | 2002-09-27 | |||
| JP2011007545A | 2011-01-13 | |||
| JP2016149502A | 2016-08-18 | |||
| JP2013065771A | 2013-04-11 |
Attorney, Agent or Firm:
SATO INTERNATIONAL PATENT FIRM (JP)
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