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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/241239
Kind Code:
A1
Abstract:
A semiconductor device A1 according to the present disclosure comprises: a support member 2; a metal member 30 which has a main surface 301 and a rear surface 302 separated from each other in a Z direction and the rear surface 302 facing the support member 2 and joined to the support member 30; a second joining layer 42 that joins the support member 2 and the metal member 30; a semiconductor element 10 that faces the main surface 301 and is joined to the metal member 30; and a sealing member 7 that covers the support member 2, the metal member 30, the second joining layer 42, and the semiconductor element 10. The metal member 30 is a porous body having a plurality of pores 31 formed therein. A semiconductor device having improved reliability by relaxing the thermal stress that occurs during heat generation in a semiconductor element can be provided.

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Inventors:
KIMURA AKIHIRO (JP)
INOUE KAITO (JP)
Application Number:
PCT/JP2020/018954
Publication Date:
December 03, 2020
Filing Date:
May 12, 2020
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/12; H01L21/52; H01L23/28; H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
WO2014129626A12014-08-28
Foreign References:
JP2013149912A2013-08-01
JP2019012767A2019-01-24
JP2013070011A2013-04-18
JP2017079217A2017-04-27
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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