SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2021/009856

A1

Provided is a semiconductor device that can reduce the possibility of a not-broken peripheral portion disposed near the semiconductor device being destroyed when a semiconductor element constituting the semiconductor device is broken due to a short circuit. The semiconductor device 1 has: one or more semiconductor elements 21 each having a positive electrode 211 to which a current is input and a negative electrode 212 which is formed on a surface parallel to the positive electrode 211 and from which the current is output; a first conductive part 22 that is fixed to and electrically connected to one of the positive electrode 211 and the negative electrode 212 of the semiconductor element 21; a second conductive part 23 that is fixed to and electrically connected to the other one of the positive electrode 211 and the negative electrode 212 of the semiconductor element 21 and is disposed in parallel to the first conductive part 22; a protective wall part 30 that surrounds the semiconductor element 21 and the second conductive part 23, is fixed to the first conductive part 22, and is configured by an explosion-proof member; and an internal resin 34 that is filled inside the protective wall part 30 and covers the conductive part 22, the conductive part 23, and the semiconductor element 21.

ITO HIROAKI (JP)
ICHIKURA YUTA (JP)
WATANABE NAOTAKE (JP)
TADA NOBUMITSU (JP)
TASHIRO SHOTA (JP)
MIZUTANI MAMI (JP)
HISAZATO YUUJI (JP)
SEKIYA HIROKI (JP)
IIO NAOTAKA (JP)

PCT/JP2019/027985

January 21, 2021

July 16, 2019

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TOSHIBA KK (JP)
TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORP (JP)

H01L25/07; H01L25/18

JP2019021684A	2019-02-07
JP2019050301A	2019-03-28
JP2010182831A	2010-08-19
JP2003110088A	2003-04-11
JP2019021682A	2019-02-07

KIUCHI Mitsuharu et al. (JP)

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