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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/009857
Kind Code:
A1
Abstract:
Provided is a semiconductor device capable of reducing deterioration caused by temperature change. The semiconductor device 1 has: at least one semiconductor element 21 having a power supply-side electrode 211 to which current is input and a load-side electrode 212 that is formed on a surface parallel to the power supply-side electrode 211 and from which current is output; a first conductive section 22 fixed to and electrically connected to either the power supply-side electrode 211 or the load-side electrode 212 in the semiconductor element 21; a second conductive section 23 fixed to and electrically connected to the other out of the power supply-side electrode 211 and the load-side electrode 212 in the semiconductor element 21 and arranged in parallel to the first conductive section 22; and a cooling unit 4 fixed, via a buffering section 6, to at least either the first conductive section 22 or the second conductive section 23.

Inventors:
WATANABE NAOTAKE (JP)
ITO HIROAKI (JP)
ICHIKURA YUTA (JP)
TADA NOBUMITSU (JP)
TASHIRO SHOTA (JP)
SEKIYA HIROKI (JP)
HISAZATO YUUJI (JP)
MIZUTANI MAMI (JP)
IIO NAOTAKA (JP)
Application Number:
PCT/JP2019/027987
Publication Date:
January 21, 2021
Filing Date:
July 16, 2019
Export Citation:
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Assignee:
TOSHIBA KK (JP)
TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORP (JP)
International Classes:
H01L25/07; H01L25/18
Foreign References:
JP2019050301A2019-03-28
JP2010182831A2010-08-19
JP2019021684A2019-02-07
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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