Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/205884
Kind Code:
A1
Abstract:
A semiconductor device (1) is provided with a protection element, a first separating region (3A), and a second separating region (3B). The protection element comprises a pn junction diode. The first separating region (3A) electrically separates an active layer (22) into a first active layer region (11) in which the pn junction diode is disposed and a second active layer region (12) in which the pn junction diode is not disposed. The second separating region (3B) separates the second active layer region (12) into a third active layer region (12A) adjacent to the first active layer region (11) with the first separating region (3A) therebetween, and a fourth active layer region (12B) adjacent to the third active layer region (12A) without being adjacent to the first active layer region (11). In addition, the potentials of the first separating region (3A) and the third active layer region (12A) are set to indefinite potentials, and the potentials of a support substrate (20) and the fourth active layer region (12B) are set to ground potentials.
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Inventors:
ADACHI KAZUYA (JP)
KATAOKA YOSHIKAZU (JP)
KATAOKA YOSHIKAZU (JP)
Application Number:
PCT/JP2021/012322
Publication Date:
October 14, 2021
Filing Date:
March 24, 2021
Export Citation:
Assignee:
TOKAI RIKA CO LTD (JP)
International Classes:
H01L21/822; H01L27/04; H01L29/06; H01L29/861; H01L29/868
Foreign References:
| JPH08306893A | 1996-11-22 | |||
| JP2001144307A | 2001-05-25 | |||
| JP2008098479A | 2008-04-24 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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