Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/176675
Kind Code:
A1
Abstract:
This semiconductor device has a P bus having a first principal surface, an N bus having a second principal surface, a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of first transistors, and is such that: each of the plurality of first circuit patterns includes a first connecting part that is connected to the P bus; each of the plurality of second circuit patterns includes a second connecting part that is connected to the N bus; each of the plurality of first transistors is electrically connected between one of the first connecting parts and one of the second connecting parts; the first principal surface and the second principal surface are parallel, and at least a portion of the first principal surface and at least a portion of the second principal surface face each other; and between the plurality of first transistors, inductance in electric current paths from the first connecting parts to the second connecting parts via the first transistors is equivalent.
Inventors:
EGUSA HIROSHI (JP)
Application Number:
PCT/JP2022/004703
Publication Date:
August 25, 2022
Filing Date:
February 07, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L25/18; H01L25/07; H02M7/48
Domestic Patent References:
| WO2017169693A1 | 2017-10-05 |
Foreign References:
| JP2005192328A | 2005-07-14 | |||
| JP2017055610A | 2017-03-16 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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