Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/220013
Kind Code:
A1
Abstract:
A semiconductor device comprising: a first die pad; a second die pad; a first semiconductor element mounted on the first die pad; a second semiconductor element mounted on the second die pad; an insulating element electrically connected to the first semiconductor element and to the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; an encapsulating resin covering the first semiconductor element, the second semiconductor element, and the insulating element; and a support member of which at least a part is an insulating portion including resin and on which the insulating element is mounted. The first die pad and the second die pad are spaced apart from each other in a first direction orthogonal to a thickness direction of the first semiconductor element. The support member is supported on at least one of the first die pad, the second die pad, and the encapsulating resin.
Inventors:
OSUMI YOSHIZO (JP)
HAMAZAWA YASUSHI (JP)
KIKUCHI TOMOHIRA (JP)
HAMAZAWA YASUSHI (JP)
KIKUCHI TOMOHIRA (JP)
Application Number:
PCT/JP2022/012573
Publication Date:
October 20, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L21/60; H01L25/07; H01L25/18
Foreign References:
| JP2016207714A | 2016-12-08 | |||
| JPH1117105A | 1999-01-22 | |||
| JP2001110986A | 2001-04-20 | |||
| JP2013239479A | 2013-11-28 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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