Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/162501
Kind Code:
A1
Abstract:
In the present invention, a sealing body (30) is a resin molded body, and seals a semiconductor element (40L), at least a portion of a substrate (50), a portion of a signal terminal (93L), a bonding wire (110), and a relay substrate (150L). The bonding wire (110) electrically connects a pad (40P) of the semiconductor element (40L) to a land (152a) of the relay substrate (150L). On a surface metal body (52) of the substrate (50), the semiconductor element (40L) is disposed in a relay wiring (55) which is a wiring section, and the relay substrate (150L) is disposed on an island (58L) which is electrically isolated from the wiring section.
Inventors:
NAKAMURA TOSHIHIRO (JP)
KUSAMA HIROTOSHI (JP)
MIZUNO NAOHITO (JP)
SHIMOZUMA AYAKO (JP)
OKUMURA TOMOMI (JP)
KUSAMA HIROTOSHI (JP)
MIZUNO NAOHITO (JP)
SHIMOZUMA AYAKO (JP)
OKUMURA TOMOMI (JP)
Application Number:
PCT/JP2023/000866
Publication Date:
August 31, 2023
Filing Date:
January 13, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2019202687A1 | 2019-10-24 | |||
| WO2014006724A1 | 2014-01-09 | |||
| WO2017119226A1 | 2017-07-13 | |||
| WO2012096066A1 | 2012-07-19 |
Foreign References:
| JP2008211237A | 2008-09-11 |
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (JP)
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