Title:
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/090137
Kind Code:
A1
Abstract:
In the present invention, a semiconductor element comprises an element body having a main surface facing one of the thickness directions, a wiring layer formed on the main surface and having continuity with the element body, and a main surface electrode formed on the wiring layer and having continuity with the wiring layer. The main surface electrode has a corner part at the outer edge when viewed in the thickness direction. The wiring layer has a first end edge extending along the outer edge of the main surface electrode when viewed in the thickness direction, and a second end edge connected to the first end edge and facing the corner part when viewed in the thickness direction. When viewed in the thickness direction, the second end edge includes a portion in which the distance to the outer edge of the main surface electrode is greater than the distance from the first end edge to the outer edge of the main surface electrode.
Inventors:
TANAKA HIROFUMI (JP)
Application Number:
PCT/JP2022/040667
Publication Date:
May 25, 2023
Filing Date:
October 31, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L29/78; H01L21/76; H01L29/12
Domestic Patent References:
| WO2020012958A1 | 2020-01-16 |
Foreign References:
| JP2011061064A | 2011-03-24 | |||
| JP2019062031A | 2019-04-18 | |||
| US20160233175A1 | 2016-08-11 | |||
| JP2017147418A | 2017-08-24 | |||
| JP2010087124A | 2010-04-15 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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