Title:
SEMICONDUCTOR ELEMENT, ELECTRIC POWER CONVERSION DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/186192
Kind Code:
A1
Abstract:
A semiconductor element according to the present invention comprises: a semiconductor chip (1); an electrode (4) provided on at least one main surface of the semiconductor chip (1); a first bonding electrode (6) provided on the electrode (4); and a second bonding electrode (7) provided on the first bonding electrode (6), wherein the electrode (4) has a raised part on a surface thereof which is located on the first bonding electrode (6) side, a surface of the first bonding electrode (6) which is located on the second bonding electrode (7) side is smooth, and a surface of the second bonding electrode (7) which is located on the opposite side from the first bonding electrode (6) is smooth.
Inventors:
ODAHARA MASASHI (JP)
SUNAMOTO MASATOSHI (JP)
UENO RYUJI (JP)
NAKAMURA SHOTARO (JP)
SUNAMOTO MASATOSHI (JP)
UENO RYUJI (JP)
NAKAMURA SHOTARO (JP)
Application Number:
PCT/JP2022/008577
Publication Date:
September 09, 2022
Filing Date:
March 01, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/28; H01L21/288; H01L21/329; H01L21/336; H01L21/60; H01L29/12; H01L29/417; H01L29/739; H01L29/78; H01L29/861; H01L29/868
Foreign References:
| JP2010251719A | 2010-11-04 | |||
| JP2017059636A | 2017-03-23 | |||
| JP2001177096A | 2001-06-29 | |||
| JP2011219828A | 2011-11-04 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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