Title:
SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/098186
Kind Code:
A1
Abstract:
The semiconductor element manufacturing method aims to divide wafers that include a substrate with high accuracy. The semiconductor element manufacturing method has a laser irradiation step in which a pulsed laser beam is focused inside of a substrate (10) constituting a wafer (1) to form multiple worked sections (12), that are separated inside the substrate (10), along an intended dividing line and to create cracks (13) that extend from the worked sections (12) at least to the surface of the substrate (10) and connect the adjoining worked sections (12), and a wafer dividing step in which the wafer (1) is divided along the intended dividing line.
Inventors:
TAMEMOTO HIROAKI (JP)
Application Number:
PCT/JP2010/051557
Publication Date:
September 02, 2010
Filing Date:
February 04, 2010
Export Citation:
Assignee:
NICHIA CORP (JP)
TAMEMOTO HIROAKI (JP)
TAMEMOTO HIROAKI (JP)
International Classes:
H01L21/301; B23K26/00; B23K26/073; B23K26/38; B28D5/00
Foreign References:
| JP2008098465A | 2008-04-24 | |||
| JP2002192368A | 2002-07-10 | |||
| JP2003338652A | 2003-11-28 | |||
| JP2006294674A | 2006-10-26 | |||
| JP2008006492A | 2008-01-17 | |||
| JP2008098465A | 2008-04-24 | |||
| JP2007324326A | 2007-12-13 |
Other References:
See also references of EP 2402984A4
Attorney, Agent or Firm:
Shinjyu Global IP (JP)
fresh green -- a global IP patent business corporation (JP)
fresh green -- a global IP patent business corporation (JP)
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