Title:
SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/137283
Kind Code:
A1
Abstract:
A first semiconductor element according to one embodiment of the present disclosure comprises: an element substrate having an element region provided by stacking a wiring layer and a first semiconductor layer containing a compound semiconductor material, and a peripheral region on the outer side of the element region; a read circuit board that faces the first semiconductor layer with the wiring layer interposed therebetween, and that is electrically connected to the first semiconductor layer through the wiring layer; a first electrode provided on the wiring layer and electrically connected to the first semiconductor layer; a second electrode facing the first electrode with the first semiconductor layer therebetween; and an insulating layer provided on the second electrode and having non-reducing properties.
Inventors:
ITO DAISUKE (JP)
MURATA KENICHI (JP)
HAYASHI TOSHIHIKO (JP)
MURATA KENICHI (JP)
HAYASHI TOSHIHIKO (JP)
Application Number:
PCT/JP2019/045726
Publication Date:
July 02, 2020
Filing Date:
November 22, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L31/10; H01L21/822; H01L27/00; H01L27/04; H01L27/146
Domestic Patent References:
| WO2018194030A1 | 2018-10-25 |
Foreign References:
| US20080067622A1 | 2008-03-20 | |||
| JP2017022313A | 2017-01-26 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Download PDF: