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Title:
CONDUCTIVE TRANSFER MATERIAL, PATTERNED BOARD MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, LAMINATED BODY, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2020/137284
Kind Code:
A1
Abstract:
Provided are: a conductive transfer material having a temporary support, a layer containing silver nanowires, and an adhesion layer having a thickness of 1 nm to 250 nm in this order; a conductive transfer material having a temporary support, a layer containing silver nanowires, and an adhesion layer having a contact resistance of 1Ω to 300Ω in this order; and an application thereof.

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Inventors:
TOYOOKA KENTARO (JP)
SUZUKI MASAYA (JP)
HIRAKI DAISUKE (JP)
Application Number:
PCT/JP2019/045774
Publication Date:
July 02, 2020
Filing Date:
November 22, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; B32B7/06; B32B15/01; B32B15/02; G03F7/027; G03F7/039; G03F7/095; G03F7/11; G03F7/20; G06F3/041; G06F3/044; H01B5/00; H01B5/02; H01B5/14; H01B13/00
Domestic Patent References:
WO2013140971A12013-09-26
Foreign References:
JP2010251186A2010-11-04
JP2013010262A2013-01-17
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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