Title:
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/215485
Kind Code:
A1
Abstract:
In this semiconductor integrated circuit device, wirings (26a, 26b) extending in an X direction are formed on a metal wiring layer. The wirings (26a, 26b) are disposed on both X-direction sides of a resistor element (RU), and are connected to the resistor element (RU). The wiring (26a) is connected to a PAD, and a wiring (27) is connected to a VSS. An anode and a cathode of an ESD protection diode (1a) are alternately formed in a Y direction. The resistor element (RU) and the wirings (26a, 26b) overlap the cathode of the ESD protection diode (1a) when viewed from above, and the wiring (27) overlaps the anode of the ESD protection diode (1a) when viewed from above.
Inventors:
TANAKA HIDETOSHI (JP)
Application Number:
PCT/JP2022/012403
Publication Date:
October 13, 2022
Filing Date:
March 17, 2022
Export Citation:
Assignee:
SOCIONEXT INC (JP)
International Classes:
H01L27/04; H01L21/82; H01L21/8234; H01L27/06
Domestic Patent References:
| WO2019163102A1 | 2019-08-29 | |||
| WO2019043888A1 | 2019-03-07 |
Foreign References:
| US20190304905A1 | 2019-10-03 | |||
| JP2010147282A | 2010-07-01 | |||
| JP2007150150A | 2007-06-14 | |||
| JP2020178061A | 2020-10-29 | |||
| JPH10163433A | 1998-06-19 | |||
| JP2016072349A | 2016-05-09 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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