Title:
ELECTROCONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/215486
Kind Code:
A1
Abstract:
The objective of the present invention is to provide: a conductive composition from which a flexible cured product having excellent conductivity and adhesiveness can be formed at a low temperature; and an electronic device using same. A conductive composition according to the present invention is characterized by comprising a polyol, a polyamine, a blocked isocyanate, and conductive particles I having an average particle size D50 of 0.4 μm to 2.0 μm, wherein a cured product obtained by curing the conductive composition at a low temperature is flexible and has high conductivity and adhesiveness.
Inventors:
TAKIMOTO NAOMI (JP)
IRIE MICHIHIKO (JP)
KONDO TAKASHI (JP)
IRIE MICHIHIKO (JP)
KONDO TAKASHI (JP)
Application Number:
PCT/JP2022/012417
Publication Date:
October 13, 2022
Filing Date:
March 17, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08K7/00; C08G18/32; C08G18/40; C08G18/80; C08K3/08; C08L75/04; H01B1/22
Domestic Patent References:
| WO2009125740A1 | 2009-10-15 | |||
| WO2015093510A1 | 2015-06-25 |
Foreign References:
| JP2011144358A | 2011-07-28 | |||
| JP2007326967A | 2007-12-20 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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