Title:
SEMICONDUCTOR INTEGRATED CIRCUIT AND ELECTRONIC INSTRUMENT
Document Type and Number:
WIPO Patent Application WO/2020/031743
Kind Code:
A1
Abstract:
The present disclosure pertains to a semiconductor integrated circuit and electronic instrument with which it is possible to further improve performance. The shape of a wiring forming a transmission network in which the same signal is transmitted is set in accordance with the distance from a driver. The wiring width is formed so as to decrease with increasing distance from the driver. The transmission network is formed from: a trunk line having a larger wiring width, the driver being connected to the trunk line; and branch lines branching from the trunk line, the branch lines having a smaller wiring width. The wiring shape of the trunk line is set so that the wiring width decreases with each part at which a second wiring branches, with increasing distance from the part at which the driver is connected. The present feature can be applied to, e.g., a clock wiring of a semiconductor integrated circuit.
Inventors:
SHIODA MAKI (JP)
HASEGAWA TAKASHI (JP)
HASEGAWA TAKASHI (JP)
Application Number:
PCT/JP2019/029367
Publication Date:
February 13, 2020
Filing Date:
July 26, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/82; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Domestic Patent References:
| WO2017122417A1 | 2017-07-20 |
Foreign References:
| JPH02224370A | 1990-09-06 | |||
| JPH0621221A | 1994-01-28 | |||
| JPH05121548A | 1993-05-18 | |||
| JP2002313921A | 2002-10-25 | |||
| JP2001228931A | 2001-08-24 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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