SEMICONDUCTOR-JOINING ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE.

WIPO Patent Application WO/2015/083587

A1

The purpose of the present invention is to provide a semiconductor-joining adhesive which has high storage stability and excellent flux characteristics and connection reliability. An additional purpose of the present invention is to provide a method for producing a semiconductor device which uses the semiconductor-joining adhesive, and a semiconductor device produced using the semiconductor-joining adhesive. The present invention pertains to a semiconductor-joining adhesive containing an epoxy compound, a curing agent, a curing accelerator, and a flux activator, wherein: the curing accelerator contains an amine compound; the flux activator is an organic acid flux activator; the curing accelerator content is 2-20 parts by weight, given that the total content of components having an epoxy group in the semiconductor-joining adhesive is 100 parts by weight; and the curing accelerator content is 40-500 parts by weight, given that the flux activator content constitutes 100 parts by weight.

TAKEDA KOHEI (JP)
ENAMI TOSHIO (JP)
HATAI MUNEHIRO (JP)
WAKIOKA SAYAKA (JP)
KONO TAKAMASA (JP)

PCT/JP2014/081173

June 11, 2015

November 26, 2014

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SEKISUI CHEMICAL CO LTD (JP)

H01L21/60; C09J11/06; C09J163/00; H05K1/18; H05K3/32

JP2012158719A	2012-08-23
JP2013155363A	2013-08-15
JP2013030766A	2013-02-07

YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)

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