SEMICONDUCTOR LAMINATE - SUMITOMO ELECTRIC INDUSTRIES

Title:

SEMICONDUCTOR LAMINATE

Document Type and Number:

WIPO Patent Application WO/2016/113924

Kind Code:

A1

Abstract:

A semiconductor laminate is provided with: a silicon carbide substrate having a first main surface, and a second main surface, which is a main surface on the opposite side from the first main surface; and an epilayer provided on the first main surface, the epilayer being made of silicon carbide. The average value Ra of the roughness of the second main surface is 0.1 to 1 μm, and the standard deviation is 25% or less of the average value.

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Inventors:

KANBARA KENJI (JP)
WADA KEIJI (JP)
HONKE TSUBASA (JP)

Application Number:

PCT/JP2015/067999

Publication Date:

July 21, 2016

Filing Date:

June 23, 2015

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)

International Classes:

H01L21/205

Foreign References:

JP2008135611A	2008-06-12
JP2012204487A	2012-10-22

Attorney, Agent or Firm:

NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)

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