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Title:
SEMICONDUCTOR LASER DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/183300
Kind Code:
A1
Abstract:
A semiconductor laser device (1) according to the present disclosure is provided with a heat sink (20), a submount (30), a first electrode (60), an insulating layer (70), a semiconductor laser element (40), a connection part (50), and a second electrode (61). The submount (30) is arranged on a first region (R1) in the upper surface of the heat sink (20), and has electrical conductivity. The first electrode (60) is arranged on a second region (R2), which is different from the first region (R1), in the upper surface of the heat sink (20), and has electrical conductivity. The first electrode (60) is electrically connected to at least a part of the lateral surface of the submount (30) or the upper surface of the submount (30).

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Inventors:
UEDA NAOTO
OOMORI KOUJI
YOSHIDA TAKAYUKI
Application Number:
PCT/JP2017/007275
Publication Date:
October 26, 2017
Filing Date:
February 27, 2017
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01S5/0233; H01S5/024
Domestic Patent References:
WO2013128794A12013-09-06
Foreign References:
JP2009009991A2009-01-15
JP2006294943A2006-10-26
JP2003060283A2003-02-28
JP2003031889A2003-01-31
JPH08228045A1996-09-03
Other References:
See also references of EP 3447863A4
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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