Title:
SEMICONDUCTOR LEAD FRAME PUNCHING MOLD ENABLING EASY SCRAP DISPOSAL
Document Type and Number:
WIPO Patent Application WO/2021/210760
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor lead frame punching mold enabling easy scrap disposal, and more specifically, to a semiconductor lead frame punching mold enabling easy scrap disposal, whereby, in a process for punching raw material which is being continuously supplied, a scrap is prevented from being jammed in a scrap groove or breaking away during punching to the outside of the scrap groove.
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Inventors:
CHOI BONG KI (KR)
CHOI PIL SUN (KR)
PARK TAE YONG (KR)
CHOI PIL SUN (KR)
PARK TAE YONG (KR)
Application Number:
PCT/KR2020/095074
Publication Date:
October 21, 2021
Filing Date:
April 22, 2020
Export Citation:
Assignee:
DONG HO A TEC CO LTD (KR)
International Classes:
B21D28/34; B21D37/08; B21D45/02
Foreign References:
| KR200405449Y1 | 2006-01-11 | |||
| KR20140114591A | 2014-09-29 | |||
| JP2010120067A | 2010-06-03 | |||
| KR0139909Y1 | 1999-04-01 | |||
| CN209334535U | 2019-09-03 | |||
| JPH0917931A | 1997-01-17 |
Attorney, Agent or Firm:
YANG, Jong Pil (KR)
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