Title:
SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048203
Kind Code:
A1
Abstract:
This semiconductor manufacturing device comprises a conveyance unit for conveying a substrate including: a product area where a die is mounted; and a frame area located outside the product area. The conveyance unit comprises: a conveyance block that, when the substrate is being conveyed, supports one end of the substrate on both upper and lower sides thereof; and a conveyance block that, when the substrate is being conveyed, supports the other end of the substrate on both upper and lower sides thereof. The conveyance blocks are provided so that one end thereof is positioned in the frame area and the other end is positioned outside the substrate. The conveyance blocks include a conveyance roller or a conveyance belt.
Inventors:
ONO YUTA (JP)
KONO KENTA (JP)
DOHI MAMORU (JP)
ITO HIROAKI (JP)
OSADA NAOTO (JP)
SASAKI KAITO (JP)
KONO KENTA (JP)
DOHI MAMORU (JP)
ITO HIROAKI (JP)
OSADA NAOTO (JP)
SASAKI KAITO (JP)
Application Number:
PCT/JP2023/028589
Publication Date:
March 07, 2024
Filing Date:
August 04, 2023
Export Citation:
Assignee:
FASFORD TECH CO LTD (JP)
International Classes:
H01L21/52; H01L21/50
Domestic Patent References:
| WO2018092191A1 | 2018-05-24 |
Foreign References:
| JP2008133118A | 2008-06-12 | |||
| JP2011006183A | 2011-01-13 | |||
| JP2003086654A | 2003-03-20 | |||
| JP2021019068A | 2021-02-15 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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