Title:
SEMICONDUCTOR MODULE MANUFACTURING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/250947
Kind Code:
A1
Abstract:
A chip component (400) including a first electrode (410) and a second electrode (420), a semiconductor device (100) including a first land (130E) and a second land (130G), and a printed wiring board (200) are prepared, a first solder paste (P1) and a second solder paste (P2) are supplied to the printed wiring board (200), the chip component (400) is placed on the printed wiring board so that the first electrode (410) is in contact with the first solder paste (P1), and the second electrode (420) is in contact with the second solder paste (P2), the semiconductor device (100) is placed on the printed wiring board so that the first land (130E) faces the first electrode (410), and the second land (130G) faces the second electrode (420), and the solder paste is melted by heating to join the first land (130E) to the first electrode (410), and the second land (130G) to the second electrode (420).
Inventors:
OONOKO KANA (JP)
AOKI TAKASHI (JP)
AOKI TAKASHI (JP)
Application Number:
PCT/JP2020/022914
Publication Date:
December 17, 2020
Filing Date:
June 10, 2020
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L23/12; H01L25/00; H05K1/18; H05K3/34
Foreign References:
| JP2002280704A | 2002-09-27 | |||
| JP2001257445A | 2001-09-21 | |||
| JPH10163263A | 1998-06-19 | |||
| JP2005150283A | 2005-06-09 |
Attorney, Agent or Firm:
CHIKASHIMA & ASSOCIATES (JP)
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