SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

WIPO Patent Application WO/2023/068096

A1

The present invention improves bonding strength between a semiconductor element and a metal wiring board, while ensuring the thickness of a joining member. The semiconductor module (1) comprises a multi-layer substrate (2) having a plurality of circuit boards (22) arranged on the upper surface of an insulating plate (20), a semiconductor element (3) arranged on the upper surface of at least one circuit board, and a metal wiring board (4) arranged on the upper surface of the semiconductor element. The metal wiring board has a first junction (40) joined to the upper surface of the semiconductor element via a first joining member (S3). The first junction includes a tabular portion having an upper surface and a lower surface, and has a boss (45) formed on the lower surface of the tabular portion and protruding toward the semiconductor element, a first recess (46) that is formed in the upper surface of the tabular portion at a location corresponding to directly above the boss, and a plurality of second recesses (49) that are formed in the upper surface and are smaller than the first recess.

NAKAMURA YOKO (JP)
IWAYA AKIHIKO (JP)
SAITO MAI (JP)
WATAKABE TSUBASA (JP)

PCT/JP2022/037802

April 27, 2023

October 11, 2022

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FUJI ELECTRIC CO LTD (JP)

H01L23/48; H01L21/60; H01L25/07; H01L25/18

WO2021039086A1

2021-03-04

JP2017084881A	2017-05-18
JP2012074543A	2012-04-12
JP2019087575A	2019-06-06

AOKI Hiroyoshi et al. (JP)

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