SEMICONDUCTOR MODULE

WIPO Patent Application WO/2018/096573

A1

The present invention provides a semiconductor module provided with at least one pair of first and second switching devices which are interposed in series between a first potential and a second potential lower than the first potential, and which operate complementarily, and first and second drive circuits that perform a drive control for the first and second switching devices, wherein the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view. The semiconductor module is provided with: a control terminal which is disposed so as to protrude from a side surface on, of first and second long sides of the package, the first long side, and to which a control signal for the first and second drive circuits is input; an output terminal which is disposed so as to protrude from a side surface on the second long side; a first main terminal disposed so as to protrude from a side surface on, of first and second short sides of the package, the first short side, and which is fed with a first potential; and a second main terminal 2 which is disposed so as to protrude from a side surface on the second short side and which is fed with a second potential.

YOKOYAMA SHUHEI (JP)
SHIBATA SHOGO (JP)
HASEGAWA MAKI (JP)
NOGUCHI KOICHIRO (JP)
MORI SHIGERU (JP)
IWAGAMI TORU (JP)

PCT/JP2016/084553

May 31, 2018

November 22, 2016

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MITSUBISHI ELECTRIC CORP (JP)

H01L25/07; H01L23/48; H01L25/18

WO2011048719A1

2011-04-28

JP2014090006A	2014-05-15
JP2016163442A	2016-09-05
JP2008053748A	2008-03-06
JP2000138342A	2000-05-16
JP2005117728A	2005-04-28
JP2008060256A	2008-03-13
JP2010109062A	2010-05-13

YOSHITAKE Hidetoshi et al. (JP)

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