Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/234803
Kind Code:
A1
Abstract:
This semiconductor module comprises a flat base plate (50), a flat relay plate (60), a terminal member (80), and an electronic component bonded to one surface of the base plate (50). The base plate (50), the relay plate (60), and the terminal member (80) are electrically conductive members and are arranged with gaps therebetween on the same plane. The electronic component and one surface of the relay plate (60) are connected by a bonding wire (46). The one surface of the relay plate (60) and one surface of the terminal member (80) are connected by the bonding wire (46).
Inventors:
TAKEUCHI KENSUKE (JP)
Application Number:
PCT/JP2020/019718
Publication Date:
November 25, 2021
Filing Date:
May 19, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2015076257A1 | 2015-05-28 |
Foreign References:
| JP2018186600A | 2018-11-22 | |||
| US20180096922A1 | 2018-04-05 | |||
| JP2015228447A | 2015-12-17 | |||
| JP2016174055A | 2016-09-29 | |||
| CN102254839A | 2011-11-23 | |||
| JP2018125424A | 2018-08-09 |
Other References:
See also references of EP 4156252A4
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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