Title:
SEMICONDUCTOR OPTICAL INTEGRATED ELEMENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/056498
Kind Code:
A1
Abstract:
Provided is an semiconductor optical integrated element in which sequentially stacked on a substrate are at least a lower cladding layer, a waveguide core layer, and an upper cladding layer, wherein the following are provided: an embedded waveguide part having a structure in which a semiconductor cladding material is embedded near both ends of the waveguide core layer; and a mesa-type waveguide part having a waveguide structure in which a semiconductor layer which includes at least the upper cladding layer protrudes in a mesa-like shape. The thickness of the upper cladding layer in the embedded waveguide part is greater than the thickness of the upper cladding layer in the mesa-type waveguide part.
Inventors:
KIYOTA KAZUAKI (JP)
KIMOTO TATSUYA (JP)
SAITO YUSUKE (JP)
KIMOTO TATSUYA (JP)
SAITO YUSUKE (JP)
Application Number:
PCT/JP2015/078161
Publication Date:
April 14, 2016
Filing Date:
October 05, 2015
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
G02B6/122; G02B6/12; G02B6/132; G02B6/136; G02F1/017; H01S5/026; H01S5/12
Foreign References:
| JP2012004441A | 2012-01-05 | |||
| JP2011108829A | 2011-06-02 | |||
| JP2012079990A | 2012-04-19 | |||
| JP2009022290A | 2009-02-05 | |||
| JP2007134480A | 2007-05-31 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Sakai international patent firm (JP)
Patent business corporation Sakai international patent firm (JP)
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