Title:
SEMICONDUCTOR PROCESSING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2017/088324
Kind Code:
A1
Abstract:
A semiconductor processing device and method, the semiconductor processing device comprising a body (1); at least one semiconductor processing unit (11) formed on the body (1), each semiconductor processing unit (11) comprising: a recessed portion (111) formed at an upper end of the body (1), the bottom wall of the recessed portion (111) having at least one position, tending downwards from the position towards an edge of the bottom wall along a direction of gravity, or tending upwards from the position towards an edge of the bottom wall along a direction opposite to the direction of gravity; at each position of the bottom wall is opened a first channel (113) communicating with the recessed portion (111); at a body located at the edge of the bottom wall of the recessed portion (111) is provided a second channel (114) communicating with the recessed portion (111); wherein, the first channel (113) and the second channel (114) can serve as a fluid outlet or outlet. The invention can control the flow direction of a fluid at a substrate surface, such that in the process of the fluid flowing into the recessed portion according to a design, the fluid contacts the substrate surface and produces a physical and/or chemical reaction, thereby processing the substrate surface.
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Inventors:
WEN SOPHIA (CN)
WANG ZHIKAI (CN)
WANG ZHIKAI (CN)
Application Number:
PCT/CN2016/076717
Publication Date:
June 01, 2017
Filing Date:
March 18, 2016
Export Citation:
Assignee:
HUAYING RES CO LTD (CN)
International Classes:
H01L21/02; H01L21/67
Domestic Patent References:
| WO2014130672A1 | 2014-08-28 |
Foreign References:
| CN101499407A | 2009-08-05 | |||
| CN1766159A | 2006-05-03 |
Other References:
See also references of EP 3382741A4
Attorney, Agent or Firm:
BEIJING SANYOU INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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