Title:
SEMICONDUCTOR PROCESSING SHEET
Document Type and Number:
WIPO Patent Application WO/2017/170021
Kind Code:
A1
Abstract:
A semiconductor processing sheet comprises an adhesive agent layer on a base material, and has the following characteristics: when the adhesive agent layer has a thickness of 200 μm, the adhesive agent layer with the thickness of 200 μm has a storage elastic modulus at 0°C of not more than 1000 MPa, and, when the semiconductor processing sheet is affixed to a mirror surface of a semiconductor wafer, the adhesive agent layer has an adhesive power of not more than 200 mN/25 mm with respect to the mirror surface.
Inventors:
SUZUKI HIDEAKI (JP)
NAKAAKI NATSUKI (JP)
TSUCHIYAMA SAYAKA (JP)
SATO AKINORI (JP)
NAKAAKI NATSUKI (JP)
TSUCHIYAMA SAYAKA (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2017/011377
Publication Date:
October 05, 2017
Filing Date:
March 22, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; B32B27/00; C09J7/20; C09J201/00
Domestic Patent References:
| WO2013103116A1 | 2013-07-11 |
Foreign References:
| JP2011174042A | 2011-09-08 | |||
| JP2011176327A | 2011-09-08 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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