Title:
SEMICONDUCTOR RELAY MODULE
Document Type and Number:
WIPO Patent Application WO/2022/030375
Kind Code:
A1
Abstract:
A semiconductor relay module includes first and second semiconductor relays, and first to third input terminals and first and second output terminals exposed from a housing. The first semiconductor relay has a first optical coupling unit and a first switching unit, and a second semiconductor relay has a second optical coupling unit and a second switching unit. The first switching unit and the second switching unit are connected by an output connection line, the third input terminal is connected to the input connection line, and the input connection line and the output connection line are covered by the housing.
Inventors:
KITAHARA DAISUKE
USHIYAMA NAOKI
TAKA SHINSUKE
USHIYAMA NAOKI
TAKA SHINSUKE
Application Number:
PCT/JP2021/028262
Publication Date:
February 10, 2022
Filing Date:
July 30, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H03K17/00; H01L31/12; H03K17/78
Foreign References:
| JPH11122087A | 1999-04-30 | |||
| JPS62289013A | 1987-12-15 | |||
| JP2002185033A | 2002-06-28 | |||
| JPH0746109A | 1995-02-14 | |||
| JP2005065150A | 2005-03-10 | |||
| JPH0746109B2 | 1995-05-17 | |||
| JP2002185033A | 2002-06-28 |
Other References:
See also references of EP 4195300A4
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
Download PDF: