Title:
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2020/170535
Kind Code:
A1
Abstract:
Provided is a protective structure for suitably protecting side surfaces of a glass substrate in a semiconductor module. The semiconductor module comprises a glass substrate. The glass substrate comprises, on the side surfaces thereof, a plurality of linear sections and corners sandwiched between the linear sections. A protective member is formed on at least a portion of the side surfaces of the glass substrate. The corners of the glass substrate are positioned to the inside of (closer to the center of the glass substrate than) a straight line connecting ridge lines of the protective member formed on the linear sections. The corners are thus protected from impacts to the side surfaces of the glass substrate.
Inventors:
OHTORII HIIZU (JP)
ADACHI KIWAMU (JP)
KAKOIYAMA NAOKI (JP)
ADACHI KIWAMU (JP)
KAKOIYAMA NAOKI (JP)
Application Number:
PCT/JP2019/046006
Publication Date:
August 27, 2020
Filing Date:
November 25, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
C03C17/32; H01L23/15
Foreign References:
| JP2013049629A | 2013-03-14 | |||
| JP2015070047A | 2015-04-13 | |||
| JP2014502950A | 2014-02-06 | |||
| JP2005244052A | 2005-09-08 | |||
| JP2000319040A | 2000-11-21 |
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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