Title:
SEMICONDUCTOR WAFER TRANSFER JIG
Document Type and Number:
WIPO Patent Application WO/2014/017587
Kind Code:
A1
Abstract:
Disclosed is a wafer transfer jig that makes it possible to uniformly heat a wafer surface at the time of heating a semiconductor wafer. As illustrated in fig. 1, this wafer transfer jig that holds and transfers a semiconductor wafer having a predetermined size is provided with: a main body member that is provided with an opening having a diameter larger than that of the semiconductor wafer; and three or more supporting members, each of which has a plurality of pin members having a predetermined length, said pin members being disposed corresponding to the diameter of the semiconductor wafer, furthermore, each of which is linearly provided, on the main body member, toward the center of the opening, and each of which constitutes a holding mechanism for concentrically holding the semiconductor wafer at a position protruding from the inner end portion of the opening.
Inventors:
MUTSUJI TOSHIHIKO (JP)
NAGATA KANAME (JP)
NAGATA KANAME (JP)
Application Number:
PCT/JP2013/070181
Publication Date:
January 30, 2014
Filing Date:
July 25, 2013
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
H01L21/673; B65G49/07
Foreign References:
| JPH05182891A | 1993-07-23 | |||
| JP2004158625A | 2004-06-03 | |||
| JP2009253115A | 2009-10-29 | |||
| JP4061904B2 | 2008-03-19 | |||
| JP2009272362A | 2009-11-19 | |||
| JPH01130540U | 1989-09-05 | |||
| JPH06151550A | 1994-05-31 | |||
| JPH06151550A | 1994-05-31 | |||
| JPS6226037U | 1987-02-17 |
Other References:
See also references of EP 2879171A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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