Title:
SENSOR ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2023/186001
Kind Code:
A1
Abstract:
A sensor assembly. The surface of one side of a housing (1) is provided with a detection port (2); a sliding groove (16) is provided in an inner surface (44) of the housing (1) close to a carrier (41) and a mounting surface (43) of the housing (1); a moving bottom plate (12) is provided on the surface of a sliding component (13) away from the sliding groove (16) and is rotatably connected to the sliding component (13); a first driving motor (14) is connected to the moving bottom plate (12) by means of a driving connecting member (15); the first driving motor (14) transmits a rotating torque to the moving bottom plate (12) by means of the driving connecting member (15) so as to drive the moving bottom plate (12) to rotate, the sliding component (13) slides in the sliding groove (16), and the moving bottom plate (12) and the sliding component (13) are linked to achieve curve movement of each point on the moving bottom plate (12), thereby achieving curve sliding of the sensor assembly (4).
Inventors:
WU KANGWEI (CN)
ZHANG XUECHUAN (CN)
SONG HEPING (CN)
ZHANG XUECHUAN (CN)
SONG HEPING (CN)
Application Number:
PCT/CN2023/085034
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
JINGWEI HIRAIN TIANJIN RES & DEVELOPMENT CO LTD (CN)
International Classes:
B60R11/00; B64D47/00
Foreign References:
| CN217294412U | 2022-08-26 | |||
| CN215928930U | 2022-03-01 | |||
| CN113043961A | 2021-06-29 | |||
| KR20190126581A | 2019-11-12 | |||
| US20150217710A1 | 2015-08-06 | |||
| US20160009230A1 | 2016-01-14 |
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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