Title:
SENSOR CHIP, MAGNETIC SENSOR COMPRISING SAME, AND MAGNETIC SENSOR PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/162157
Kind Code:
A1
Abstract:
[Problem] To precisely position an external magnetic body with respect to a sensor chip. [Solution] After a sensor chip 20 is mounted on a substrate 10, an external magnetic body 30 is mounted on the substrate 10 so as to overlap with a magnetic body layer M1 in a view from a Y direction perpendicular to an element formation surface 21. At this time, the position of the external magnetic body 30 in an X direction is adjusted with reference to alignment marks 60, 61 which are provided to the sensor chip 20 and are visible from the upper surface 25 side of the sensor chip 20. Thus, it is possible to achieve a desired positional relation between the sensor chip 20 and the external magnetic body 30 at the time of assembly.
Inventors:
ONODERA IKUHITO (JP)
HARAKAWA OSAMU (PH)
HARAKAWA OSAMU (PH)
Application Number:
PCT/JP2022/007962
Publication Date:
August 31, 2023
Filing Date:
February 25, 2022
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
G01R33/02
Domestic Patent References:
| WO2020175119A1 | 2020-09-03 |
Foreign References:
| JP2020067331A | 2020-04-30 | |||
| JP2011128095A | 2011-06-30 | |||
| JP2013012634A | 2013-01-17 | |||
| JP2005142252A | 2005-06-02 | |||
| US20170256707A1 | 2017-09-07 | |||
| US20180138396A1 | 2018-05-17 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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