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Patent Searching and Data


Title:
SENSOR COVER
Document Type and Number:
WIPO Patent Application WO/2021/152919
Kind Code:
A1
Abstract:
A sensor cover (1) comprises: a cover film (10) that comprises an upper cover film (10a) and lower cover film (10b) that are connected on at least one side and is formed into a bag shape that can accommodate a temperature sensor (101) during use; an adhesive affixing member (20) that is provided on the outer surface of the lower cover film (10b); a sensor attachment member (30) that is provided on the inner surface of the lower cover film (10b) and adhesively attaches the temperature sensor (101) to the lower cover film (10b); and a sealing member (40) that adhesively closes the edge of an opening part of the cover film (10).

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Inventors:
TSUCHIMOTO HIROFUMI (JP)
MATSUMOTO SHINICHIRO (JP)
SHIMUTA TORU (JP)
Application Number:
PCT/JP2020/038137
Publication Date:
August 05, 2021
Filing Date:
October 08, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01D11/24; A61B5/01; A61B5/25; A61B5/318; G01K13/20
Domestic Patent References:
WO2019093144A12019-05-16
Foreign References:
US5218973A1993-06-15
JP2019203881A2019-11-28
JP5086235B22012-11-28
Attorney, Agent or Firm:
UEDA Kazuhiro (JP)
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