Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/193141
Kind Code:
A1
Abstract:
The purpose of the present invention is to further improve water barrier property between an end portion of a wiring member and a resin mold part. This sensor device comprises a sensor element, a wiring member connected to the sensor element, a resin mold part which covers an end portion of the wiring member and the sensor element, and an annular elastic member which is disposed between the outer circumference of the wiring member and the resin mold part.
Inventors:
SHIMIZU MORIYUKI (JP)
NAKAMURA MASAHARU (JP)
NAGAO RIEKO (JP)
MURAMATSU HIROKI (JP)
KATO KOICHI (JP)
KOBAYASHI TOSHINARI (JP)
TERASAKA YUKITOSHI (JP)
KIM KYUNGWOO (JP)
NAKAMURA MASAHARU (JP)
NAGAO RIEKO (JP)
MURAMATSU HIROKI (JP)
KATO KOICHI (JP)
KOBAYASHI TOSHINARI (JP)
TERASAKA YUKITOSHI (JP)
KIM KYUNGWOO (JP)
Application Number:
PCT/JP2021/010040
Publication Date:
September 30, 2021
Filing Date:
March 12, 2021
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
G01P1/02
Domestic Patent References:
| WO2019124209A1 | 2019-06-27 |
Foreign References:
| US20150189783A1 | 2015-07-02 | |||
| JPH1138024A | 1999-02-12 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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