Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/193142
Kind Code:
A1
Abstract:
The purpose of the present invention is to further improve imperviousness to water between a resin-molded part and an end part of a wiring member. A sensor device according to the present invention comprises: a sensor element; a wiring member that is connected to the sensor element; a first resin-molded part that covers the sensor element and an end part of the wiring member; and a second resin-molded part that is molded, via a mold, separately from the first resin-molded part, and is integrally combined with the first resin-molded part.
Inventors:
SHIMIZU MORIYUKI (JP)
NAKAMURA MASAHARU (JP)
NAGAO RIEKO (JP)
MURAMATSU HIROKI (JP)
KATO KOICHI (JP)
KOBAYASHI TOSHINARI (JP)
TERASAKA YUKITOSHI (JP)
KIM KYUNGWOO (JP)
NAKAMURA MASAHARU (JP)
NAGAO RIEKO (JP)
MURAMATSU HIROKI (JP)
KATO KOICHI (JP)
KOBAYASHI TOSHINARI (JP)
TERASAKA YUKITOSHI (JP)
KIM KYUNGWOO (JP)
Application Number:
PCT/JP2021/010048
Publication Date:
September 30, 2021
Filing Date:
March 12, 2021
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
G01P1/02
Foreign References:
| JP2016017939A | 2016-02-01 | |||
| US20150189783A1 | 2015-07-02 | |||
| JP2009262548A | 2009-11-12 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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