SENSOR-MOUNTED WAFER

WIPO Patent Application WO/2018/199601

A1

The present invention relates to a sensor-mounted wafer having a shape in which wafers are bonded so as to support processes performed in different temperature conditions while sensor circuits for monitoring a semiconductor process are mounted therein, and comprises: a lower portion first wafer having at least one recess; and an upper portion second wafer having at least one recess and bonded to the first wafer, wherein the first wafer includes: a first recess; a first insulating film formed on the inside of the first recess and the upper surface of the first wafer; a first electrode formed, from one side of the upper surface of the first wafer, on the first insulating film over a one side inner wall of the first recess and one side of the bottom surface thereof; a second electrode spaced from the first electrode on the bottom surface of the first recess and formed, from the other side of the upper surface of the first wafer, on the first insulating film over the other side inner wall of the first recess and the other side of the bottom surface thereof; and a first sensor circuit making electrical contact with the first electrode and the second electrode on the bottom surface of the first recess.

BAE JEONG WOON (KR)

PCT/KR2018/004753

November 01, 2018

April 24, 2018

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SNTEK CO LTD (KR)

H01L21/66; H01L21/02; H01L21/67

KR20020009365A	2002-02-01
JP2007178253A	2007-07-12
KR20140133775A	2014-11-20
US20070251339A1	2007-11-01
US20010012639A1	2001-08-09

CHUN, Sang Koo (KR)

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