Title:
SENSOR PACKAGING AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/182395
Kind Code:
A1
Abstract:
A method for manufacturing a sensor packaging, according to one embodiment of the present invention, comprises: a step of etching both sides of a main substrate to form a via hole which passes through the main substrate; a step of forming an insulation layer on the wall surface of the via hole and both sides of the main substrate; a step of bonding, to the main substrate, a sub-substrate in which a metal seed layer and a bonding layer, which has a pattern for exposing a part of the seed layer, are stacked; a step of forming a filling layer which fills the via hole with a metal to cover the top surface of the main substrate; and a step of removing the sub-substrate from the main substrate.
Inventors:
YOON SANG WON (KR)
Application Number:
PCT/KR2016/005106
Publication Date:
November 17, 2016
Filing Date:
May 13, 2016
Export Citation:
Assignee:
INDUSTRY-UNIV COOP FOUND HANYANG UNIV (KR)
International Classes:
H01L23/48; H01L23/00; H01L23/532
Foreign References:
| US20060046432A1 | 2006-03-02 | |||
| KR20050000184A | 2005-01-03 | |||
| US20060292866A1 | 2006-12-28 | |||
| KR101312593B1 | 2013-09-30 | |||
| KR20120012602A | 2012-02-10 |
Attorney, Agent or Firm:
SHIM, Kyoung-Shik et al. (KR)
심경식 (KR)
심경식 (KR)
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