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Title:
SEPARATION METHOD FOR LAYERED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/090695
Kind Code:
A1
Abstract:
Provided is a separation method for a layered structure in which a resin layer is layered on a substrate, the separation method having a step in which shear load is applied to the layered structure from a direction intersecting the layering direction of the resin layer and a step in which the substrate is pulverized, and the resin layer being separated from the substrate at the interface between the substrate and the resin layer.

Inventors:
HARADA HIDEKI (JP)
Application Number:
PCT/JP2020/039781
Publication Date:
May 14, 2021
Filing Date:
October 22, 2020
Export Citation:
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Assignee:
SOLAR FRONTIER KK (JP)
International Classes:
B09B3/00; B09B5/00
Domestic Patent References:
WO2017047802A12017-03-23
Foreign References:
JP2003245567A2003-09-02
JP2000167836A2000-06-20
JP2017006839A2017-01-12
JP2017136516A2017-08-10
JP2016190177A2016-11-10
JP2009214058A2009-09-24
JP2014104406A2014-06-09
JP2012019134A2012-01-26
JP2008068204A2008-03-27
JP2016203061A2016-12-08
JP2016203128A2016-12-08
JP2019201487A2019-11-21
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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