Title:
SHAPE MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/171192
Kind Code:
A1
Abstract:
[Solution] According to the present invention, a shape measurement device, for acquiring a plurality of surface images while scanning a surface of a measurement object 1 that is plate-like, and measuring a shape of the measurement object 1, includes an image-capturing system 10 that irradiates the measurement object 1 by parallel light and acquires surface images, a stage system 30 that holds the measurement object 1 and adjusts an orientation of the measurement object 1 as to the image-capturing system 10, and a control device 20. The control device 20 includes an orientation adjusting unit 21 that controls the image-capturing system 10 and the stage system 30 so as to scan the surface while adjusting the orientation, and acquire the plurality of surface images, and an image processing unit 22 that generates a three-dimensional shape restoration model of the measurement object 1 from the plurality of surface images that are acquired. When acquiring the surface images, the orientation adjusting unit 21 adjusts the orientation such that an incident angle of the parallel light to the surface is within a range that is set in advance. According to this shape measurement device, shape measurement of measurement objects that are plate-like, and in particular even notch portions of wafers that have complicated shapes, can be performed with higher precision.
Inventors:
TSURU TAIRA (JP)
Application Number:
PCT/JP2023/003617
Publication Date:
September 14, 2023
Filing Date:
February 03, 2023
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
G01B11/24
Domestic Patent References:
| WO2016098469A1 | 2016-06-23 |
Foreign References:
| JP2003057016A | 2003-02-26 | |||
| JP6590429B1 | 2019-10-16 |
Attorney, Agent or Firm:
SPRING IP (JP)
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