Title:
SHEET BONDING AND ALIGNMENT SYSTEM AND SHEET BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/011080
Kind Code:
A1
Abstract:
The present application relates to a sheet bonding and alignment system and a sheet bonding method. The sheet bonding and alignment system comprises an alignment mechanism; the alignment mechanism comprises a support platform and a press-fit head; the support platform is provided with a support end surface and a first vacuum suction hole penetrating the support end surface; the press-fit head is provided with a press-fit surface; the press-fit surface faces the support end surface, and the distance between the press-fit surface and the support end surface is adjustable; and the first vacuum suction hole is used to suck a sheet to be bonded, and the press-fit head is used to press-fit the sheet sucked by the first vacuum suction hole.
More Like This:
| WO/2014/179968 | APPARATUS AND METHOD FOR PLATING AND/OR POLISHING WAFER |
| WO/2020/229263 | PHOTO-ANNEALING IN METAL OXIDE SENSORS |
| WO/2021/025914 | HIGH DENSITY LOGIC FORMATION USING MULTI-DIMENSIONAL LASER ANNEALING |
Inventors:
WANG BIN (CN)
HSIAO CHUN-LUNG (CN)
FAN CHUNLIN (CN)
WANG QING (CN)
ZHAN RUIQI (CN)
HSIAO CHUN-LUNG (CN)
FAN CHUNLIN (CN)
WANG QING (CN)
ZHAN RUIQI (CN)
Application Number:
PCT/CN2022/103748
Publication Date:
February 09, 2023
Filing Date:
July 04, 2022
Export Citation:
Assignee:
CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)
International Classes:
H01L21/67; B30B15/00; F16B11/00; H01L21/683
Foreign References:
| CN111550481A | 2020-08-18 | |||
| CN110703473A | 2020-01-17 | |||
| CN206834159U | 2018-01-02 | |||
| CN109001925A | 2018-12-14 | |||
| CN206201541U | 2017-05-31 | |||
| JP2020194192A | 2020-12-03 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
Download PDF:
Previous Patent: COMMUNICATION METHOD AND APPARATUS
Next Patent: RESOURCE SCHEDULING METHOD AND COMMUNICATION DEVICE
Next Patent: RESOURCE SCHEDULING METHOD AND COMMUNICATION DEVICE