Title:
SHEET MOLDING COMPOUND AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/080240
Kind Code:
A1
Abstract:
Provided are: a sheet molding compound excellent in terms of handleability and reinforcing-fiber-filling property; and a molded article excellent in terms of mechanical property and heat resistance. The sheet molding compound comprises a thermosetting resin composition and reinforcing fiber bundles, wherein the thermosetting resin composition comprises the following ingredient (C) and an epoxy resin ingredient (E) comprising a product (1) of reaction between the following ingredients (A) and (B); and the molded article is an object obtained by press-molding the sheet molding compound. Ingredient (A): an epoxy resin which is liquid at 25°C. Ingredient (B): a polymer having a functional group reactive with ingredient (A). Ingredient (C): an epoxy hardener.
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Inventors:
OGASAWARA HAYATO (JP)
OOTA AKIRA (JP)
MURANO YASUNORI (JP)
OOTA AKIRA (JP)
MURANO YASUNORI (JP)
Application Number:
PCT/JP2019/039940
Publication Date:
April 23, 2020
Filing Date:
October 10, 2019
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G59/42; C08J5/24; C08K5/1539; C08K7/02; C08L63/00
Domestic Patent References:
| WO2018190329A1 | 2018-10-18 | |||
| WO2019026724A1 | 2019-02-07 |
Foreign References:
| JPH08301948A | 1996-11-19 | |||
| JPS5968321A | 1984-04-18 | |||
| JP2000026574A | 2000-01-25 | |||
| JP2016121355A | 2016-07-07 | |||
| JP2018195255A | 2018-12-06 | |||
| JPH0288684A | 1990-03-28 | |||
| JP2004189811A | 2004-07-08 | |||
| JP2004043769A | 2004-02-12 | |||
| JP2001354788A | 2001-12-25 |
Other References:
See also references of EP 3868815A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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