Title:
SHIELD FLAT CABLE
Document Type and Number:
WIPO Patent Application WO/2019/208737
Kind Code:
A1
Abstract:
The present invention is further provided with: a lower insulating layer 122 bonded to the lower surface 112 of a conductor 110; a lower dielectric layer 132 bonded to the lower surface 122a of the lower insulating layer 122; a lower shield layer 142a bonded to the lower surface 132a of the lower dielectric layer 132; a terminal part T in which the conductor 110 is exposed to a longitudinal end section; a reinforcing plate 160 adhering to the lower surface 122a of the lower insulating layer 122 and the lower surface 112 of the conductor 110 at the terminal part T; and a ground member 170 bonded to the lower surface 162 of the reinforcing plate 160 and the lower surface 142a of a lower shield layer 142 and electrically connected to the lower shield layer 142, wherein the ground member 170 extends below the terminal part T.
Inventors:
KOJIMA CHIAKI (JP)
MATSUDA TATSUO (JP)
MATSUDA TATSUO (JP)
Application Number:
PCT/JP2019/017803
Publication Date:
October 31, 2019
Filing Date:
April 25, 2019
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01B7/08; H01B7/00; H01R13/648
Foreign References:
| JP2018181775A | 2018-11-15 | |||
| JP2002150848A | 2002-05-24 | |||
| JPH08287733A | 1996-11-01 | |||
| JP2017139180A | 2017-08-10 |
Attorney, Agent or Firm:
TOWA NAGISA INTERNATIONAL PATENT FIRM (JP)
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