Title:
SHOCK ABSORBING PACKAGING MATERIAL AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/085478
Kind Code:
A1
Abstract:
A shock absorbing packaging material enabling the supply of air into its air chambers at a low pressure by eliminating a defective meld-bonding, comprising the air chambers (11) divided by meld-bonding lines (18) formed by thermally meld-bonding a first packaging film (14) and a second packaging film (15) to each other after a first valve film (16) and a second valve film (17) are disposed therebetween in an overlapped state and an air filling passage (12) formed between the first valve film (16) and the second valve film (17) and forming an air passage when the air is filled in the air chambers (11). The packaging material is characterized in that a meld-bonding prevention material (13) not meld-bonded to both the first and second valve films (16) and (17) in thermal meld-bonding is installed on the packaging material at a portion where the air filling passage (12) is formed.
Inventors:
UCHIDA HIROFUMI (JP)
Application Number:
PCT/JP2006/301823
Publication Date:
August 17, 2006
Filing Date:
February 03, 2006
Export Citation:
Assignee:
ISHIDO YOSHIYASU (JP)
UCHIDA HIROFUMI (JP)
UCHIDA HIROFUMI (JP)
International Classes:
B65D81/03; B65D81/07; B65D81/00; B65D81/05
Domestic Patent References:
| WO1996022926A1 | 1996-08-01 |
Foreign References:
| JPH0834478A | 1996-02-06 | |||
| JP2003175944A | 2003-06-24 |
Attorney, Agent or Firm:
Senda, Minoru (6th Floor 25, Ichibanch, Chiyoda-ku Tokyo, JP)
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