SIGNAL TRANSMITTING STRUCTURE, METHOD FOR MANUFACTURING SIGNAL TRANSMITTING STRUCTURE, AND HIGH-FREQUENCY SIGNAL TRANSMITTING/RECEIVING DEVICE

WIPO Patent Application WO/2019/220530

A1

The present invention is a signal transmitting structure, wherein electrical inspection is performed appropriately while characteristic degradation due to parasitic components is suppressed. The signal transmitting structure is provided with a first signal line conductor (003), a second signal line conductor (004), and a first columnar conductor (100) formed so as to extend from an upper surface of a dielectric layer (010A) to the second signal line conductor via the first signal line conductor. The length from a short-circuit structure (020) that is formed on the upper surface of the dielectric layer and that short-circuits the upper end of the first columnar conductor to a section connecting, via the first columnar conductor, the first columnar conductor and the first signal line conductor is an odd multiple of one-fourth the wavelength of a signal to be transmitted.

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MORIMOTO YASUO (JP)
YOSHIOKA HIDEHARU (JP)
YAMADA TAKUMA (JP)
NISHI SHINYA (JP)
HATATE TSUYOSHI (JP)

PCT/JP2018/018734

November 21, 2019

May 15, 2018

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MITSUBISHI ELECTRIC CORP (JP)

H05K3/46; H01P5/08; H05K1/02

JP2004146810A	2004-05-20
JP2012199895A	2012-10-18
JP2016072818A	2016-05-09
JP2016018837A	2016-02-01
JP2014150524A	2014-08-21
JP2001088097A	2001-04-03

YOSHITAKE Hidetoshi et al. (JP)

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