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Title:
SILICA-CONTAINING SILICONE RESIN COMPOSITION AND ITS MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2006/035646
Kind Code:
A1
Abstract:
This invention provides a silica-containing silicone resin composition which can impart high heat resistance, high transparency, and high dimensional stability and is suitable, for example, for optical applications such as lenses, optical disks, optical fibers, and flat panel display substrates, and window materials for automobiles. This silica-containing silicone resin composition is produced by incorporating 1 to 70% by weight of silica fine particles into a silicone resin composition prepared by mixing a silicone resin, which is represented by [RSiO3/2]n wherein R represents an (meth)acryloyl-containing organic functional group; and n is 8, 10 or 12, and is composed mainly of polyorganosilsesquioxane having a basket structure in its structural units, and an unsaturated compound, which contains in its molecule at least one unsaturated group represented by -R3-CR4=CH2 or -CR4=CH2 wherein R3 represents an alkylene group, an alkylidene group, or group -OCO-; and R4 represents hydrogen or an alkyl group, and is radically copolymerizable with the silicone resin at a weight ratio of 1 : 99 to 99 : 1.

Inventors:
SAITO TAKASHI (JP)
ISOZAKI MASAYOSHI (JP)
ANDO HIDEKI (JP)
YAMASAKI AKIKO (JP)
Application Number:
PCT/JP2005/017368
Publication Date:
April 06, 2006
Filing Date:
September 21, 2005
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO (JP)
SAITO TAKASHI (JP)
ISOZAKI MASAYOSHI (JP)
ANDO HIDEKI (JP)
YAMASAKI AKIKO (JP)
International Classes:
C08F230/08; C08F2/44; C08K3/36; C08L43/04; C07F7/21
Domestic Patent References:
WO2002083764A12002-10-24
Foreign References:
JP2001046122A2001-02-20
JP2004143449A2004-05-20
JP2004314468A2004-11-11
JPS581756A1983-01-07
Attorney, Agent or Firm:
Naruse, Katsuo (TKK Nishishinbashi Bldg. 11-5, Nishi-shinbashi 2-chom, Minato-ku Tokyo 03, JP)
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