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Title:
SILICON CARBIDE SINGLE CRYSTAL WAFER AND METHOD FOR PRODUCING SILICON CARBIDE SINGLE CRYSTAL INGOT
Document Type and Number:
WIPO Patent Application WO/2016/051485
Kind Code:
A1
Abstract:
Provided is a SiC single crystal wafer fabricated from a SiC single crystal ingot grown by a sublimation recrystallization method, the SiC single crystal wafer achieving a high device performance and high yields in device fabrication when used as a device fabrication wafer. The SiC single crystal wafer has a basal plane dislocation density of a surface of 1000/cm2 or less, a threading screw dislocation density of 500/cm2 or less, and a Raman shift value of 0.2 or less. Also provided is a method for producing a SiC single crystal ingot by controlling heat input from the side surface of a single crystal ingot during single crystal growth and growing crystals while reducing change in temperature distribution of the single crystal ingot.

Inventors:
NAKABAYASHI MASASHI (JP)
SHIMOMURA KOTA (JP)
NAGAHATA YUKIO (JP)
KOJIMA KIYOSHI (JP)
Application Number:
PCT/JP2014/076014
Publication Date:
April 07, 2016
Filing Date:
September 30, 2014
Export Citation:
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Assignee:
NIPPON STEEL & SUMIKIN MAT CO (JP)
International Classes:
C30B29/36; C30B23/06
Domestic Patent References:
WO2010041497A12010-04-15
WO2013081164A12013-06-06
WO2013157418A12013-10-24
Foreign References:
JP2013047159A2013-03-07
JP2014002104A2014-01-09
JP2002284599A2002-10-03
JP2007119273A2007-05-17
JP2001294499A2001-10-23
JP2013139347A2013-07-18
JP2006290705A2006-10-26
JP2005093519A2005-04-07
Other References:
See also references of EP 3026147A4
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Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)
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