SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE

Title:

SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE

Document Type and Number:

WIPO Patent Application WO/2006/077667

Kind Code:

A1

Abstract:

A silicone composition for encapsulating luminescent elements which comprises: (A) a vinylated organopolysiloxane of a three-dimensional network structure represented by the average rational formula (SiO_4/2)_a(ViR₂SiO_1/2)_b(R₃SiO_1/2)_c (wherein Vi represents vinyl; R's are the same or different and each represents an (un)substituted monovalent hydrocarbon group other than alkenyl; and a, b, and c each is a positive number, provided that 0.2≤a/(a+b+c)≤0.6 and 0.001≤b/(a+b+c)≤0.2); (B) an organohydrogenpolysiloxane which has at least two silicon-bonded hydrogen atoms per molecule and is contained in such an amount that the amount of the silicon-bonded hydrogen atoms is 0.3-3.0 mol per mol of the silicon-bonded vinyl groups in the ingredient (A); and (C) a hydrosilylation catalyst (catalytic amount). The composition after curing has a coefficient of linear expansion of 10×10^-6 to 290×10^-6 per °C. This composition can give a cured object which enables itself and the base to have a reduced residual stress and thereby retains satisfactory and stable adhesiveness over long.

Inventors:

MOCHIZUKI KIKUO (JP)
HIRAI NOBUO (JP)

Application Number:

PCT/JP2005/013451

Publication Date:

July 27, 2006

Filing Date:

July 22, 2005

Export Citation:

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Assignee:

GE TOSHIBA SILICONES CO LTD (JP)
MOCHIZUKI KIKUO (JP)
HIRAI NOBUO (JP)

International Classes:

C08L83/07; C08L83/05; H01L23/29; H01L23/31; H01L33/56

Foreign References:

JP2000198930A	2000-07-18
JP2004186168A	2004-07-02
JP2004002810A	2004-01-08
JP2004140220A	2004-05-13
JP2004359756A	2004-12-24
JP2003073548A	2003-03-12
JP2002338833A	2002-11-27
JP2004292807A	2004-10-21
JP2005042099A	2005-02-17

Other References: