Title:
SILICONE COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2012/164636
Kind Code:
A1
Abstract:
A silicone composition for sealing a semiconductor, characterized by comprising: (A) 100 parts by weight of a polyorganosiloxane having one or more alkenyl groups, on average, per molecule, said polyorganosiloxane being obtained by reacting 60-99 parts by weight of an organosiloxane (a1), which at least contains a trifunctional siloxane unit represented by the formula R1SiO3/2 (wherein R1 represents an alkyl group or an aryl group) and does not participate in a hydrosilyl reaction, with 40-1 parts by weight of an organosiloxane (a2) which contains an alkenyl group-containing functional siloxane unit and/or a monofunctional siloxane unit; (B) a polyorganohydrogen siloxane, which has two or more hydrogen atoms bonded to a silicon atom per molecule and has a viscosity at 25oC of 1-1000 mPa∙s, in such an amount as to give 0.5-3.0 mol of hydrogen atoms per mol of the alkenyl group in component (A); and (C) a platinum-based catalyst, and a cured product of said silicone composition showing a decrease in storage modulus of 40% or greater when temperature rises from 25oC to 50oC. The silicone composition forms a cured product having an appropriate modulus and enables a large decrease in the modulus of the cured product upon heating.
Inventors:
MOCHIZUKI KIKUO (JP)
TAKAGI AKIRA (JP)
TAKAGI AKIRA (JP)
Application Number:
PCT/JP2011/006287
Publication Date:
December 06, 2012
Filing Date:
November 10, 2011
Export Citation:
Assignee:
MOMENTIVE PERFORMANCE MAT JP (JP)
MOCHIZUKI KIKUO (JP)
TAKAGI AKIRA (JP)
MOCHIZUKI KIKUO (JP)
TAKAGI AKIRA (JP)
International Classes:
C08L83/07; C08L83/05; H01L33/56
Domestic Patent References:
| WO2011125463A1 | 2011-10-13 |
Foreign References:
| JP2007008996A | 2007-01-18 | |||
| JP2004359756A | 2004-12-24 | |||
| JP2009173789A | 2009-08-06 | |||
| JP2008280367A | 2008-11-20 | |||
| JP2012012524A | 2012-01-19 | |||
| JP2009242627A | 2009-10-22 | |||
| JP2009242627A | 2009-10-22 |
Other References:
See also references of EP 2716717A4
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)
Patent business corporation cherry tree international patent firm (JP)
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