Title:
SILICONE-MODIFIED EPOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2005/121219
Kind Code:
A1
Abstract:
A silicone-modified epoxy resin (D) having units represented by the following structural formula (4) which is obtained by reacting the epoxy group of 4-vinylcyclohexene 1-oxide (A), which is represented by the following formula (1), with a silanol group of a silanol-containing organopolysiloxane (B) represented by the following empirical formula (2) to obtain a vinylated polyether compound (C) having units represented by the following structural formula (3), and epoxidizing the vinyl group(s) of the compound (C) with an oxidizing agent. The resin thus obtained is a polyfunctional alicyclic epoxy resin which has oxycyclohexane skeletons and is improved in heat resistance and hygroscopicity. (1) RaSi(OH)bO(4-a-b)/2 .....(2) (3) (4) (In the formula (2), a is 0.01 to 1.99, b is 1.99 to 0.01, and R is a C1-9 monovalent organic compound residue. The vinyl group in the formula (3) and the epoxy group in the formula (4) each is bonded in the &agr -position or β-position in the formula.)
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Inventors:
OKAZAKI AKIRA (JP)
Application Number:
PCT/JP2004/008299
Publication Date:
December 22, 2005
Filing Date:
June 08, 2004
Export Citation:
Assignee:
DAICEL CHEM (JP)
OKAZAKI AKIRA (JP)
OKAZAKI AKIRA (JP)
International Classes:
C08G77/14; C08G77/38; (IPC1-7): C08G77/14
Foreign References:
| JP2004250604A | 2004-09-09 | |||
| JPS6245644A | 1987-02-27 | |||
| JPH02225516A | 1990-09-07 |
Attorney, Agent or Firm:
Goto, Yukihisa (7-16 Higashitenma 2-chome, Kita-k, Osaka-shi Osaka, JP)
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